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Langasite as-grown Boules
  
Diameter/Width 80-100 mm
Thickness/Length Up to 150 mm
Orientation along <00.1>, <01.1> and <11.0> axis
Surface quality As-grown

Langasite Substrates for SAW Applications
  
Diameter 76.2-101.4 mm
Thickness 0.5 mm
Orientation Primary flat is perpendicular to X\' axis with accuracy ±15 min, Yxlt/48.5°/26.6°
LTV 2.2 microns for the base 20 mm X 20mm
Surface quality No dimples, cracks, unpolished areas, contaminants in working area under x50 magnification. Scratches visible at x50 magnification are allowed in working area if their quantity is lower than 3 on one wafer and less than 20 in a lot of one hundred wafers.
Edge chipping No chipping inside the working area and on the primary flat. Chipping can be accepted outside the working area if the width is less than 0.5 mm, and the cumulative length is less than 5 mm.
Working face Working area: wafer diameter minus 3 mm

Langatate blocks and plates for sensing parts
  
Diameter/Width Up to 80 mm
Thickness/Length, X-cut 5-30 mm
Thickness/Length, Y-cut 5-30 mm
Thickness/Length, Z-cut Up to 100 mm

Langatate sensing parts
  
Outer diameter 6-15 mm
Inner diameter 3-6 mm
Thickness >=0.15 mm
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